Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
by Shuye Zhang and Guoli Sun
English | 2025 | ISBN: 1837241406 | 199 pages | True PDF | 28.9 MB
by Shuye Zhang and Guoli Sun
English | 2025 | ISBN: 1837241406 | 199 pages | True PDF | 28.9 MB